A Greener Way to Package Electronic Components

Profiles used to package electronic components such as semiconductors, connectors and switches need to have excellent clarity to allow for visual or optical inspection of the packaged products.  They are also required to have good impact strength to adequately protect the contents during transit.  

We have been offering PETG (Copolymer Polyethylene Terephthalate Glycol) resins for the production of such profiles as a green alternative to PVC Compounds.  Compared to PVC, PETG is recyclable, more thermally stable than PVC and will not give out harmful by-products during processing.  PETG can be extruded, injection moulded and blow-moulded.